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GTL2034
4-bit GTL to GTL buffer
Rev. 01 -- 11 November 2005
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Product data sheet
1. General description
The GTL2034 is a 4-bit GTL-/GTL/GTL+ bus buffer. The GTL2034 GTL inputs and outputs operate up to 3.6 V, allowing the device to be used in higher voltage open-drain output applications.
2. Features
s s s s s s Operates as a 4-bit GTL-/GTL/GTL+ to GTL-/GTL/GTL+ bus buffer 3.0 V to 3.6 V operation GTL input and output 3.6 V tolerant Vref adjustable from 0.5 V to VCC / 2 Partial power-down permitted ESD protection exceeds 2000 V HBM per JESD22-A114, 200 V MM per JESD22-A115, and 1000 V CDM per JESD22-CC101 s Latch-up protection exceeds 500 mA per JESD78 s Package offered: TSSOP14
3. Quick reference data
Table 1: Quick reference data Tamb = 25 C Symbol tPLH tPHL Ci Parameter LOW-to-HIGH propagation delay HIGH-to-LOW propagation delay input capacitance Conditions GTL; BIn to BOn; CL = 50 pF; VCC = 3.3 V GTL; outputs disabled; VI/O = 0 V or 3.0 V Min Typ 3.1 4.1 4.5 Max 8 10 Unit ns ns pF
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GTL2034
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4-bit GTL to GTL buffer
4. Ordering information
Table 2: Ordering information Package Name GTL2034PW TSSOP14 Description plastic thin shrink small outline package; 14 leads; body width 4.4 mm Version SOT402-1 Type number
4.1 Ordering options
Table 3: Ordering options Topside mark GTL2034 Temperature range Tamb = -40 C to +85 C Type number GTL2034PW
5. Functional diagram
GTL2034
BO0 BI0
BO1
BI1
BO2
BI2
BO3
BI3
VREF
002aab148
Fig 1. Logic diagram of GTL2034
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Product data sheet
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6. Pinning information
6.1 Pinning
n.c. BO0 BO1 VREF BO2 BO3 GND
1 2 3 4 5 6 7
002aab147
14 VCC 13 BI0 12 BI1
GTL2034PW
11 GND 10 BI2 9 8 BI3 GND
Fig 2. Pin configuration for TSSOP14
6.2 Pin description
Table 4: Symbol n.c. BO0 BO1 BO2 BO3 BI0 BI1 BI2 BI3 VREF GND VCC Pin description Pin 1 2 3 5 6 13 12 10 9 4 7, 8, 11 14 GTL reference voltage ground (0 V) positive supply voltage data inputs (GTL) Description not connected data outputs (GTL)
7. Functional description
Refer to Figure 1 "Logic diagram of GTL2034".
7.1 Function table
Table 5: BIn (GTL) Input Function table BOn (GTL) BOn = BIn Input/output
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Product data sheet
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4-bit GTL to GTL buffer
8. Limiting values
Table 6: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). [1] Voltages are referenced to GND (ground = 0 V). Symbol VCC IIK VI IOK VO IOL Tstg
[1]
Parameter supply voltage input clamping current input voltage output clamping current output voltage LOW-state output current [3] storage temperature
Conditions VI < 0 V B port VO < 0 V output in OFF or HIGH state; B port B port
[4]
Min -0.5 -0.5 [2] -0.5 [2] -60
Max +4.6 -50 +4.6 -50 +4.6 80 +150
Unit V mA V mA V mA C
Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Section 9 "Recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input and output negative voltage ratings may be exceeded if the input and output clamp current ratings are observed. Current into any output in the LOW state. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150 C.
[2] [3] [4]
9. Recommended operating conditions
Table 7: Recommended operating conditions Unused inputs must be held HIGH or LOW to prevent them from floating. Symbol VCC VTT Parameter supply voltage termination voltage [1] GTL- GTL GTL+ Vref reference voltage overall GTL- GTL GTL+ VI VIH VIL IOL Tamb
[1]
Conditions
Min 3.0 0.85 1.14 1.35 0.5 0.5 0.76 0.87 0 Vref + 0.050 -40
Typ 0.9 1.2 1.5
2 V 3 TT
Max 3.6 0.95 1.26 1.65 VCC / 2 0.63 0.84 1.10 3.6 Vref - 0.050 40 +85
Unit V V V V V V V V V V V mA C
0.6 0.8 1.0 VTT -
input voltage HIGH-state input voltage LOW-state input voltage LOW-state output current ambient temperature
B port B port B port B port operating in free air
VTT maximum of 3.6 V with resistor sized so IOL maximum is not exceeded.
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Product data sheet
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4-bit GTL to GTL buffer
10. Static characteristics
Table 8: Static characteristics Recommended operating conditions; voltages are referenced to GND (ground = 0 V). Tamb = -40 C to +85 C Symbol VOL II ILO ICC Ci Co
[1] [2]
Parameter LOW-state output voltage input current output leakage current quiescent supply current input capacitance output capacitance
Conditions B port; VCC = 3.0 V; IOL = 40 mA B port; VCC = 3.6 V; VI = VTT or GND B port; VCC = 3.6 V; VO = VTT B port; VCC = 3.6 V; VI = VCC or GND; IO = 0 mA port BIn; VO = VTT or 0 V port BOn; VO = VTT or 0 V
[2]
Min -
Typ [1] 0.2 4 4.5 5.5
Max 0.4 1 1 8 -
Unit V A A mA pF pF
All typical values are measured at VCC = 3.3 V and Tamb = 25 C. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
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Product data sheet
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4-bit GTL to GTL buffer
10.1 Performance curves
002aab144 002aab145
1200 Vth+ and Vth- (mV) 1000
1200 Vth+ and Vth- (mV) 1000
800
Vth+ Vth- Vref
800
Vth+ Vth- Vref
600
600
400 0.5
0.6
0.7
0.8
0.9
1.0 Vref (V)
400 0.5
0.6
0.7
0.8
0.9
1.0 Vref (V)
a. VCC = 3.0 V; Tamb = -40 C
1200 Vth+ and Vth- (mV) 1000
b. VCC = 3.3 V; Tamb = 25 C
002aab146
800
Vth+ Vth- Vref
600
400 0.5
0.6
0.7
0.8
0.9
1.0 Vref (V)
c. VCC = 3.6 V; Tamb = 85 C Fig 3. GTL Vth+ and Vth- versus Vref
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Product data sheet
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11. Dynamic characteristics
Table 9: Dynamic characteristics VCC = 3.3 V 0.3 V Symbol tPLH tPHL tPLH tPHL tPLH tPHL
[1]
Parameter LOW-to-HIGH propagation delay HIGH-to-LOW propagation delay LOW-to-HIGH propagation delay HIGH-to-LOW propagation delay LOW-to-HIGH propagation delay HIGH-to-LOW propagation delay
Conditions BIn to BOn; see Figure 4
Min -
Typ [1] 2.8 5.2 3.1 4.1 3.3 3.6
Max 8 10 8 10 8 10
Unit ns ns ns ns ns ns
GTL-; Vref = 0.6 V; VTT = 0.9 V
GTL; Vref = 0.8 V; VTT = 1.2 V BIn to BOn; see Figure 4
GTL+; Vref = 1.0 V; VTT = 1.5 V BIn to BOn; see Figure 4
All typical values are at VCC = 3.3 V and Tamb = 25 C.
11.1 Waveforms
VM = Vref for B ports.
VTT input Vref tPLH 3.0 V VM VM 0V
002aab140 002aab149
Vref1
1/ V 3 TT
tpulse output
tPHL VOH Vref Vref2 VOL
a. Pulse duration Fig 4. Voltage waveforms
b. Propagation delay times
12. Test information
VTT VCC PULSE GENERATOR VI D.U.T.
RT CL 30 pF 25
VO
002aab143
CL = load capacitance; includes jig and probe capacitance. RT = termination resistance; should be equal to Zo of pulse generator.
Fig 5. Load circuit for B outputs
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Product data sheet
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4-bit GTL to GTL buffer
13. Package outline
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm SOT402-1
D
E
A
X
c y HE vMA
Z
14
8
Q A2 pin 1 index A1 Lp L (A 3) A
1
e bp
7
wM detail X
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT402-1 REFERENCES IEC JEDEC MO-153 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-18 A max. 1.1 A1 0.15 0.05 A2 0.95 0.80 A3 0.25 bp 0.30 0.19 c 0.2 0.1 D (1) 5.1 4.9 E (2) 4.5 4.3 e 0.65 HE 6.6 6.2 L 1 Lp 0.75 0.50 Q 0.4 0.3 v 0.2 w 0.13 y 0.1 Z (1) 0.72 0.38 8 o 0
o
Fig 6. Package outline SOT402-1 (TSSOP14)
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Product data sheet
Rev. 01 -- 11 November 2005
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4-bit GTL to GTL buffer
14. Soldering
14.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended.
14.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 seconds and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 C to 270 C depending on solder paste material. The top-surface temperature of the packages should preferably be kept:
* below 225 C (SnPb process) or below 245 C (Pb-free process)
- for all BGA, HTSSON..T and SSOP..T packages - for packages with a thickness 2.5 mm - for packages with a thickness < 2.5 mm and a volume 350 mm3 so called thick/large packages.
* below 240 C (SnPb process) or below 260 C (Pb-free process) for packages with a
thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages. Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
14.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results:
* Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.
* For packages with leads on two sides and a pitch (e):
- larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board;
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Product data sheet
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- smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end.
* For packages with leads on four sides, the footprint must be placed at a 45 angle to
the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb or Pb-free respectively. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
14.4 Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 seconds to 5 seconds between 270 C and 320 C.
14.5 Package related soldering information
Table 10: Package [1] BGA, HTSSON..T [3], LBGA, LFBGA, SQFP, SSOP..T [3], TFBGA, VFBGA, XSON DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON, HTQFP, HTSSOP, HVQFN, HVSON, SMS PLCC [5], SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO, VSSOP CWQCCN..L [8], PMFP [9], WQCCN..L [8]
[1] [2]
Suitability of surface mount IC packages for wave and reflow soldering methods Soldering method Wave not suitable not suitable [4] Reflow [2] suitable suitable
suitable not not recommended [5] [6] recommended [7]
suitable suitable suitable not suitable
not suitable
For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026); order a copy from your Philips Semiconductors sales office. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 C 10 C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible.
[3]
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Product data sheet
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4-bit GTL to GTL buffer
[4]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. The appropriate soldering profile can be provided on request. Hot bar soldering or manual soldering is suitable for PMFP packages.
[5] [6] [7] [8]
[9]
15. Abbreviations
Table 11: Acronym CDM ESD GTL HBM MM TTL Abbreviations Description Charged Device Model ElectroStatic Discharge Gunning Transceiver Logic Human Body Model Machine Model Transistor-Transistor Logic
16. Revision history
Table 12: Revision history Release date 20051111 Data sheet status Product data sheet Change notice Doc. number 9397 750 13543 Supersedes Document ID GTL2034_1
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Product data sheet
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4-bit GTL to GTL buffer
17. Data sheet status
Level I II Data sheet status [1] Objective data Preliminary data Product status [2] [3] Development Qualification Definition This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).
III
Product data
Production
[1] [2] [3]
Please consult the most recently issued data sheet before initiating or completing a design. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
18. Definitions
Short-form specification -- The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition -- Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information -- Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes -- Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
20. Trademarks
Notice -- All referenced brands, product names, service names and trademarks are the property of their respective owners.
19. Disclaimers
Life support -- These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors
21. Contact information
For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
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Product data sheet
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4-bit GTL to GTL buffer
22. Contents
1 2 3 4 4.1 5 6 6.1 6.2 7 7.1 8 9 10 10.1 11 11.1 12 13 14 14.1 14.2 14.3 14.4 14.5 15 16 17 18 19 20 21 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 3 Function table . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Recommended operating conditions. . . . . . . . 4 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5 Performance curves . . . . . . . . . . . . . . . . . . . . . 6 Dynamic characteristics . . . . . . . . . . . . . . . . . . 7 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Introduction to soldering surface mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . . 9 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . . 9 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 10 Package related soldering information . . . . . . 10 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 11 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 12 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Contact information . . . . . . . . . . . . . . . . . . . . 12
(c) Koninklijke Philips Electronics N.V. 2005
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 11 November 2005 Document number: 9397 750 13543
Published in The Netherlands

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